800G OSFP to 2x400G RHS OSFP Passive DAC Breakout Cable: 800G-PDAC-OSFP-2xOSFPRHS

Our EDGEOPTIC 800G-PDAC-OSFP-2xOSFPRHS is a multi-vendor compatible 800G OSFP to 2x400G Flat Top OSFP passive direct attach copper breakout cable designed for flexible high-bandwidth connectivity in modern hyperscale data center environments. The 800G-PDAC-OSFP-2xOSFPRHS cable features a breakout configuration with one 800G OSFP connector splitting into two independent 400G OSFP (Flat Top) connectors, enabling efficient bandwidth distribution by connecting a single 800G switch port to 2 separate 400G devices such as switches, routers, or high-performance computing nodes. This cross-connector variant bridges Flat Top and Finned Top OSFP infrastructure, supporting mixed-housing data center deployments.

The cable supports aggregate data rates up to 850 Gbps, utilizing eight independently operating 106.25 Gbps PAM4 lanes split across two 400G OSFP (Flat Top) channels of four lanes each. For Ethernet deployments, the cable enables a single 800G Ethernet port to drive 2 independent 400G Ethernet connections at 400G per channel, supporting efficient bandwidth distribution across network tiers. Additionally, the cable supports InfiniBand NDR for high-performance computing and AI/ML training infrastructure. This breakout configuration is particularly valuable for network migration scenarios, allowing gradual transition from 400G to 800G infrastructure while maximizing existing equipment investments.

As a passive DAC solution, the 800G-PDAC-OSFP-2xOSFPRHS requires no external power and introduces zero latency to signal transmission, making it ideal for latency-sensitive applications such as distributed AI training, high-frequency trading systems, and real-time analytics platforms. The cable construction utilizes high-quality twinax copper with optimized wire gauges: AWG30 for lengths from 0.5 to 1 meter, and AWG26 for lengths from 1.5 to 2 meters. This progressive wire gauge selection ensures optimal signal integrity at 106.25 Gbps PAM4 signaling per lane while maintaining practical cable flexibility for installation in dense rack environments.

The 1-to-2 breakout configuration is particularly valuable for spine-to-leaf architectures where 800G spine switch ports need to connect to multiple 400G leaf switches. This approach maximizes expensive 800G port utilization while providing each downstream device with dedicated 400G bandwidth. The passive design eliminates power consumption concerns entirely and reduces overall system power budget.

The electrical interface conforms to OSFP MSA and CMIS Rev 5.1 specifications, ensuring broad compatibility with standard OSFP host systems from multiple equipment vendors. Our breakout DAC cables can be encoded for compatibility with major networking vendors, and we can support encoding of each end to support different vendor equipment, allowing using the breakout DAC as a cross-platform interconnection medium. The cable incorporates DDM/DOM (Digital Diagnostic Monitoring) functionality, providing real-time diagnostic data including module temperature and supply voltage through the CMIS-compatible interface for proactive network monitoring.

Standards compliance includes IEEE 802.3ck for 100 Gbps per lane electrical signaling alongside InfiniBand NDR specifications. The cable operates within a 0 to 70C temperature range, suitable for controlled data center environments. With an MTBF rating of 1,000,000 hours, the cable delivers long-term reliability for mission-critical infrastructure deployments.

Typical deployment scenarios include 800G spine to 400G leaf switch connectivity, port multiplication in bandwidth-constrained environments, and phased 400G-to-800G migration rollouts. The passive design eliminates power consumption entirely, contributing to greener data center operations.

Our 800G OSFP to 2x400G Flat Top OSFP passive breakout DAC is CE/RoHS certified and compliant with product safety standards. Because our focus is providing top quality service, we perform comprehensive quality checks before delivery including electrical parameter measurements, connector inspection tests, and OSFP EEPROM memory data validation tests.