800G OSFP RHS to 2x400G QSFP112 Passive DAC Breakout Cable: 800G-PDAC-OSFPRHS-2xQSFP112

Our EDGEOPTIC 800G-PDAC-OSFPRHS-2xQSFP112 is a multi-vendor compatible 800G OSFP FT to 2x400G QSFP112 passive direct attach copper breakout cable designed for flexible cross-form-factor connectivity in modern hyperscale data center and AI/ML training environments. The 800G-PDAC-OSFPRHS-2xQSFP112 cable features a breakout configuration with one 800G OSFP (Flat Top) connector splitting into two independent 400G QSFP112 connectors, enabling efficient interconnection between OSFP-based switching infrastructure and QSFP112-equipped network adapters, DPUs, and server NICs.

The cable supports aggregate data rates up to 850 Gbps, utilizing eight independently operating 106.25 Gbps PAM4 lanes split across two 400G QSFP112 channels of four lanes each. For Ethernet deployments, the cable enables a single 800G Ethernet switch port to drive 2 independent 400G Ethernet connections to QSFP112 host interfaces, supporting efficient bandwidth distribution in GPU cluster and high-performance computing environments. The QSFP112 form factor on the breakout side is specifically designed for compatibility with the latest generation of network adapters including NVIDIA ConnectX-7 and BlueField-3 DPUs, making this cable essential for AI/ML training infrastructure. Additionally, the cable supports InfiniBand NDR for high-performance computing and AI/ML training infrastructure.

As a passive DAC solution, the 800G-PDAC-OSFPRHS-2xQSFP112 requires no external power and introduces zero latency to signal transmission, making it the optimal choice for latency-critical applications such as distributed AI training, GPU-to-GPU communication, and real-time inference workloads. The cable construction utilizes high-quality twinax copper with optimized wire gauges: AWG30 for lengths from 0.5 to 1 meter, and AWG26 for lengths from 1.5 to 2 meters. This progressive wire gauge selection ensures optimal signal integrity at 106.25 Gbps PAM4 signaling per lane while maintaining practical cable flexibility for installation in dense rack environments.

The cross-form-factor breakout configuration is particularly valuable in mixed-architecture deployments where 800G OSFP switches need to connect to servers and compute nodes equipped with QSFP112 ports. This approach maximizes expensive 800G port utilization while providing each downstream device with dedicated 400G bandwidth through the industry-standard QSFP112 interface. The passive design eliminates power consumption concerns entirely and reduces overall system power budget.

The electrical interface conforms to OSFP MSA, QSFP112 MSA, and CMIS Rev 5.1 specifications, ensuring broad compatibility with both OSFP and QSFP112 host systems from multiple equipment vendors. Our breakout DAC cables can be encoded for compatibility with major networking vendors, and we can support encoding of each end to support different vendor equipment, allowing using the breakout DAC as a cross-platform interconnection medium. The cable incorporates DDM/DOM (Digital Diagnostic Monitoring) functionality, providing real-time diagnostic data including module temperature and supply voltage through the CMIS-compatible interface for proactive network monitoring.

Standards compliance includes IEEE 802.3ck for 100 Gbps per lane electrical signaling alongside InfiniBand NDR specifications. The cable operates within a 0 to 70C temperature range, suitable for controlled data center environments. With an MTBF rating of 1,000,000 hours, the cable delivers long-term reliability for mission-critical infrastructure deployments.

Typical deployment scenarios include 800G OSFP switch to 400G QSFP112 NIC connectivity in GPU clusters, AI/ML training infrastructure with mixed OSFP and QSFP112 interfaces. The passive design eliminates power consumption entirely, contributing to greener data center operations.

Our 800G OSFP FT to 2x400G QSFP112 passive breakout DAC is CE/RoHS certified and compliant with product safety standards. Because our focus is providing top quality service, we perform comprehensive quality checks before delivery including electrical parameter measurements, connector inspection tests, and EEPROM memory data validation tests.