10G BiDi XFP 40km Transceiver (Side A): BIDI-10G-XFP-40A

Product Description for BIDI-10G-XFP-40A

Our EDGEOPTIC BIDI-10G-XFP-40A is a multi-vendor compatible 10G BiDi XFP single-fiber optical module designed for long-reach 10 Gigabit Ethernet applications requiring simplex fiber connectivity. While XFP represents a legacy transceiver form factor approaching end-of-life status in many deployments, this module continues to serve critical infrastructure requiring XFP compatibility. The BIDI-10G-XFP-40A operates with transmit wavelength at 1270nm and receive wavelength at 1330nm, supporting data rates from 1.24 to 11.32 Gbps across multiple protocol standards and applications. Our 10G BiDi XFP transceiver utilizes DFB (Distributed Feedback) laser technology for transmission paired with PIN photodiode for optical reception. The transceiver ensures a 16 dB guaranteed optical link budget, which determines the maximum transmission distance capabilities. Over single-mode fiber, the transceiver reliably reaches distances up to 40 kilometers using single strand connectivity, effectively doubling fiber infrastructure capacity for metropolitan deployments. However, distance is just an indicative parameter calculated for convenience of identification – ultimately we calculate distance considering minimal optical budget and average attenuation of optical cabling in the industry.

The BIDI-10G-XFP-40A compatible module features hot-pluggable XFP architecture with single LC/UPC connector as the optical interface, utilizing internal WDM filtering to enable bidirectional transmission over one fiber strand. This Side A transceiver must be paired with corresponding Side B unit (BIDI-10G-XFP-40B) featuring complementary wavelengths – transmitting at 1330nm and receiving at 1270nm. The electrical interface conforms to INF-8077i XFP MSA Rev.4.5 specifications, ensuring compatibility with legacy XFP host systems supporting multiple vendor equipment platforms. Our 10G BiDi XFP transceiver can be encoded to maintain compatibility and successfully operate across 80+ brands of network equipment. The module incorporates DDM/DOM (Digital Diagnostic Monitoring) functionality providing real-time operational data including transmitted and received optical power levels, module temperature, laser bias current, and supply voltage. The module operates within standard 0 to 70°C temperature range, with appropriate thermal management for sustained operation in controlled telecommunications environments.

Standards compliance encompasses IEEE 802.3ae for 10 Gigabit Ethernet, alongside comprehensive SDH/SONET specifications supporting STM-16 through STM-64, and multi-rate Fiber Channel support from 1G to 10G. Additionally, the transceiver supports Optical Transport Network applications including ODU0 through ODU2e and OTU1 through OTU2f standards. The transceiver achieves multi-vendor interoperability through strict adherence to industry MSA standards, though equipment implementing vendor-specific module validation may require custom EEPROM programming for seamless compatibility. Our 10G BiDi XFP transceiver maintains CE/RoHS certification and complies with Class 1 FDA and IEC60825-1 laser safety standards.

Typical applications include metropolitan area network deployments where fiber scarcity demands single-strand solutions, inter-facility connections requiring XFP compatibility over 40-kilometer distances, and existing telecommunications infrastructure seeking capacity optimization without additional cable installation. BiDi technology proves particularly valuable in long-haul leased fiber scenarios where monthly recurring costs justify single-fiber architectures across metropolitan spans. The multi-rate capability accommodates legacy Gigabit Ethernet operation at 1.25 Gbps alongside native 10 Gigabit rates, providing operational flexibility for mixed-speed network deployments where XFP form factor remains mandatory. Because our focus centers on providing top quality service, we perform comprehensive quality checks before delivery. Consequently, we conduct optical parameter measurements, connector cleanliness tests, and XFP transceiver EEPROM memory data validation tests for every module.